Eccostock® LoK

LOW LOSS LOW-K DIELECTRIC MATERIAL

Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and microwave insulation. It weighs only about half that of polystyrene and one quarter that of polytetrafluorethylene. Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only slightly degrade in the immediate area of contact. It is completely unicellular and is unaffected by moisture.

Caratteristiche del prodotto
Caratteristiche e Benefici
  • Low dielectric constant
  • Lightweight
  • Good dimensional stability
Mercati
  • Commercial Telecom
  • Security and Defense
Esempi di applicazioni
  • Eccostock LoK is specifically designed for use in coaxial, wave guide and antenna support problems. Due to the low dielectric constant, reflections in transmission lines are minimized.
  • RF coils wound on Eccostock LoK exhibithigher Q than when wound on polystyrene or other plastic stock.
Disponibilità
  • Eccostock LoK is available in the following standard sizes:
  • Sheets 30.5 x 30.5cm (12” x 12”) in thicknesses of 0.32, 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81, 5.08, 6.35 & 7.62 cm (1/8, 1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5, 2.0, 2.5 & 3.0”)
  • Rods 30.5 cm (12”) long in diameters of 0.32, 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81, 5.08, 6.35 & 7.62 cm (1/8, 1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5, 2.0, 2.5 & 3.0”).
  • Bars 30.5 cm (12”) long in squares of 0.64, 0.95, 1.27, 1.59, 1.91, 2.54, 3.81 & 5.08 cm (1/4, 3/8, 1/2, 5/8, 3/4, 1.0, 1.5 & 2.0”). Other sizes, shapes, thicknesses, and configurations are available on special order.
Istruzioni per l’uso
  • Machinability of Eccostock LoK is excellent.
  • Gumming does not occur and automatic screw machine operations are possible with it.
Proprietà

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pan style=”font-weight: 400;”>Proprietà

Proprità  ECCOSTOCK LOK
Temperature Range °C (°F)-70 to 150 (-94 to 302)
Frequency60 Hz to 10 Ghz
Density g/cc0.54
Dielectric Constant1.7
Dielectric Strength, volts/mil (kv/mm)300 (11.8)
Dissipation Factor<0.004
Volume Resistivity, ohm-cm1014
Flexural Strength, kg/cm2 (psi)420 (6,000)
Coefficient of Linear Expansion, per°C (°F)50 x 10-6 (28 x 10-6)
Thermal Conductivity W/mK0.4
Water absorption (%gain in 24h at 25°C)0.1

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