LOW LOSS LOW-K DIELECTRIC MATERIAL
Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and microwave insulation. It weighs only about half that of polystyrene and one quarter that of polytetrafluorethylene. Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only slightly degrade in the immediate area of contact. It is completely unicellular and is unaffected by moisture.
Caratteristiche e Benefici |
---|
|
Mercati |
|
Esempi di applicazioni |
|
Disponibilità |
|
Istruzioni per l’uso |
|
ECCOSTOCK HIK POWDERs=”row-2 even”>
pan style=”font-weight: 400;”>Proprietà
Proprità | ECCOSTOCK LOK |
---|---|
Temperature Range °C (°F) | -70 to 150 (-94 to 302) |
Frequency | 60 Hz to 10 Ghz |
Density g/cc | 0.54 |
Dielectric Constant | 1.7 |
Dielectric Strength, volts/mil (kv/mm) | 300 (11.8) |
Dissipation Factor | <0.004 |
Volume Resistivity, ohm-cm | 1014 |
Flexural Strength, kg/cm2 (psi) | 420 (6,000) |
Coefficient of Linear Expansion, per°C (°F) | 50 x 10-6 (28 x 10-6) |
Thermal Conductivity W/mK | 0.4 |
Water absorption (%gain in 24h at 25°C) | 0.1 |
Euro Technologies propone una vasta selezione di prodotti. All’interno del catalogo generale vengono descritte, per ciascuna gamma, le caratteristiche e le specifiche tecniche e i benefici, le varianti disponibili e le possibili applicazioni.