Thermally conductive pre-preg dielectric

Thanks to its outstanding electrical insulating properties, this thermally conductive pre-preg allows the use of metal-based materials as heat spreaders in printed circuit board laminates.

High thermal conductivity of approximately 3 W / mK, high dielectric strength of 800 V / mil, strong adhesion and room temperature stability make this product ideal as a pre-preg in thermally conductive PCBs.