Gap filler – EU-UTP100

Gap filler
Specific product Characteristics
Features&Benefits
  • Thermal Conductivity: 1.0 W/mK
  • High conformability
  • Electrically insulating
  • Naturally tacky
Configurations
  • Sheet 200x400mm
  • Die-cut parts
  • Kiss cut parts on sheet
Typical application
  • Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
  • Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
  • Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
Product properties
PropertiesUnitsEU-UTP100Test Method
Composition–Ceramic filled Silicone with faberglass lamination on top–
Colour–Pink & WhiteVisual
Thickness Rangemm0,5≈6,0–
HardnessShore C10ASTM D2240
Densityg/cc2.0ASTM D792
Tensile StrenghtkN/m2,5ASTM D412
Elongation%60%ASTM D412
Continuous Use Temp°C-40 to 150EN344
Breakdown VoltagekV/mm≥ 6,5ASTM D149
Volume ImpedanceOhm-cm6,2*1015ASTM D257
Dielectric Constant1MHz5,27ASTM D150
Flammability Rating–V-0UL94
Thermal ConductivityW/m.K1,0ASTM E1461
UL,RoHS, REACH–Compliance–
Compressure deflection

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Euro Technologies offers a wide selection of products. Inside the general catalogue are described, each range, including its features and benefits, specifications, the available variants and possible applications.

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