Gap filler – EU-TP200

Gap filler
Specific product Characteristics
Features&Benefits
  • Thermal Conductivity: 2.0 W/mK
  • High conformability
  • Electrically insulating
  • Naturally tacky/
Configurations
  • Sheet 200x400mm
  • Custom Die-cut parts
  • Kiss cut parts on sheet
Typical application
  • Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
  • Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC,
    power supply etc
  • Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
Product properties
PropertiesUnitsMetric ValueTest Method
Construction & Composition–Ceramic filled Silicone–
Colour–Dark GrayVisual
Thickness Rangemm0,5≈6,0–
HardnessShore C25ASTM D2240
Densityg/cc2,79ASTM D792
Tensile StrenghtkN/m0,33ASTM D412
Elongation%78ASTM D412
Continuous Use Temp°C-40 to 150EN344
Breakdown VoltagekV/mm≥ 6,0ASTM D149
Volume ImpedanceOhm-cm1,1*1016ASTM D257
Dielectric Constant1MHz5,75ASTM D150
Flame Rating–V-0UL94
Thermal ConductivityW/m.K2,0ASTM E1461
UL,RoHS, REACH–Compliance–
Compression deflection

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GAP FILLER - EU-TP200 - TECHNICAL DATA SHEET

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GENERAL CATALOGUE

Euro Technologies offers a wide selection of products. Inside the general catalogue are described, each range, including its features and benefits, specifications, the available variants and possible applications.

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