Gap filler – EU-TF110

Gap filler

EU-TF110 is a very soft, free standing gap filler designed to combine good thermal conductivity of 1,1 W/mK with high compliancy. The special ceramic filler allows EU-TF110 to remain a cost effective solution where moderate thermal performance is acceptable.

EU-TF110 is naturally tacky and does not require an additional adhesive coating that can inhibit thermal performance.

EU-TF110 is electrically insulating, stable from -40°C to 160°C and meets UL 94V0 rating side.

Specific product Characteristics
Features&Benefits
  • Thermal conductivity 1,1 W/mK
  • Soft and compliant for low stress applications
  • Available in 20 thicknesses from
    0,25mm to 5,0mm
Configurations
  • Sheet 228x228mm
  • Die cut parts
  • Kiss cut parts on sheet
Typical application
  • Plasma display panels
  • Telecommunication hardware
  • Mass storage drives
  • Automotive engine control units
  • Memory modules
  • Wireless communication HW
  • Base station
  • Heat pipe thermal sol
Product properties
PropertiesEU-TF110Test Method
ColourLight GreyVisual
ConstructionFilled silicone elastomer–
Thermal Conductivity1,1 W/mKASTM D5470
Specific Gravity1,73 g/ccH.P.
Operating Temperature-40°C to 160 °C–
Hardness50 shore 00ASTM D2240
Volumic Resistivity10 ^13 ohm-cmASTM D257
UL Flamming Rating94 V0UL
Thickness Range0,25mm – 5,0mm–
Outgassing TML0,34%ASTM E595
Outgassing CVCM0,10%ASTM E595

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GAP FILLER - EU-TF110 - TECHNICAL DATA SHEET

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Catalogo generale - Euro Technologies

GENERAL CATALOGUE

Euro Technologies offers a wide selection of products. Inside the general catalogue are described, each range, including its features and benefits, specifications, the available variants and possible applications.

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