Gap filler – EU-TP080

Gap filler
Specific product Characteristics
Features&Benefits
  • Thermal Conductivity: 0.8 W/mK
  • High conformability
  • Electrically insulating
  • Naturally tacky
Configurations
  • Sheet 200x400mm
  • Die-cut parts
  • Kiss cut parts on sheet
Typical application
  • Between electronic components such as semiconductor, IC, CPU.MOS and heatsink
  • Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
  • Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
Product properties
PropertiesUnitsEU-TP080Test Method
Composition–Ceramic filled Silicone–
Color–Light GrayVisual
Thickness Rangemm0,5≈12,0–
HardnessShore C18ASTM D2240
Densityg/cc2ASTM D792
Tensile StrenghtkN/m1,3ASTM D412
Elongation%1,35ASTM D412
Continuous Use Temp°C-40 to 150EN344
Breakdown VoltagekV/mm≥ 4,0ASTM D149
Volume ImpedanceOhm-cm1,7*1016ASTM D257
Dielectric Constant1MHz4,51ASTM D150
Weight Daminify–≤ 1%@150°C 240H
Flammability Rating–V0UL94
Thermal ConductivityW/m.K0,8ASTM E1461
UL,RoHS, REACH–Compliance–
Compressure deflection

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GAP FILLER - EU-TP080 - TECHNICAL DATA SHEET

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