Description

Eccostock® FFP

FREE FLOWING SYNTACTIC FOAM POWDER

Eccostock FFP is a one-part, epoxy-based, free-flowing powder. It cures at elevated temperatures to a rigid, non-burning syntactic foam. It is extremely light weight and provides physical support as well as thermal insulation without increasing the weight or dielectric constant. Eccostock FFP exhibits minimum shrinkage during cure, exerting minimum stress on delicate components. Cured material can be easily removed with tools enabling access to repair or replace components.Since cured Eccostock FFP is porous, application of an epoxy coating will reduce moisture absorption.

Specific product Characteristics

Features&Benefits
Low cost Low shrinkage during cure No mixing required and easy to use as it i sa one part curing system
Markets
Commercial Telecom Security and Defense
Typical application
Eccostock FFP is designed to infiltrate densely populated electronic packages, readily filling available volumes around components. It been used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally protected. Eccostock FFP has also found its way into machinery operating in high vibration environments to keep electrical components from shaking apart. Low shrink age during cure makes Eccostock FFP excellent for encapsulation applications.
Availability
Eccostock FFP is readily available in pints,quarts, gallons, and 5 gallon containers. Pint and quart containers are also available in squeeze bottles for ease of application.
Instructions for use
Refer to the MSDS for full safety information before opening the container. Measures should be taken to avoid any contact with the skin and eyes, and a dust mask or respirator should be used to avoid inhaling the product. Mix the Eccostock FFP in the shipping container by lightly tumbling or shaking before use, as some components may separate during shipping and storage. In a well ventilated area, carefully pour the Eccostock FFP from a small paper cup or dispense from a squeeze bottle into the device being filled. Light to moderate vibration is recommended to maximize packing of the material. Eccostock FFP bonds well to itself and most other substrates. Mold release wax is recommended in applications where removal from a mold is necessary. Shelf life is 6 months if store dina cool dry place out of direct sunlight at 21°C(70°F). Elevated temperature curing is required. Select one of the following recommended curing times and temperatures: Cure Times and Temperatures 24 hours at 100°C (212°F) 4 hours at 120°C (248°F) 2 hours at 150°C (302°F)

Product properties

Properties	ECCOSTOCK ADHESIVE 13111
Temperature Range °C (°F)	-65 to 175 (-85 to 347)
Density, g/cc	0.24
Compression Strength kPa (psi)	1000 (150)
Dielectric Constant @ 8.6 GHz	1.25
Loss Tangent @ 8.6 GHz	0.005
Dielectric Strength, volts/mil	64
Thermal Conductivity W/mK	0.051
Volume Resistivity, ohm-cm	3.49 x 10¹¹

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Euro Technologies offers a wide selection of products. Inside the general catalogue are described, each range, including its features and benefits, specifications, the available variants and possible applications.

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