Thermal and EMI shielding Film
CoolShield-Flex is a stack-up film of thermal interface materials (TIM), metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics.
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Typical Properties | TFLEX HR600 |
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Construction | Filled silicone elastomer |
Color | Dark Grey |
Thermal Conductivity ASTM D5470 | 3W/mK |
Hardness (Shore 00) ASTM D2240 (3 second) | 40 |
Density | 2.5 g/cc |
Operating temperature range | -45°C up to 200°C |
Volume resistivity ASTM D257 | 1013 Ohm-cm |
UL Flammability Rating | 94V0 |
Typical Properties | TPCM585 |
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Construction | Non-reinforced film |
Color | Grey |
Specific gravity | 2.87 g/cc |
Thermal Conductivity | 3.8 W/mK |
Phase change softening temperature | 50° C |
Operating temperature range | -40°C up to 125°C |
Volume resistivity | 3.0 x 1012 Ohm-cm |
Typical Properties | COPPER FOIL WITH CPSA |
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Adhesive strength with 180o Peel | ≥1.3kg/inch |
Operating temperature range (°C) | -20°C up to 120°C |
Euro Technologies offers a wide selection of products. Inside the general catalogue are described, each range, including its features and benefits, specifications, the available variants and possible applications.